 PROCESS
|
Layer number |
1-40 |
Meterial
|
FR1,FR2,FR3,FR4,CEM 1,CEM 3,FLEX,HYBRID,ALUMINIUM,TEFLON,ROGERS, ENVIRONMENT FRIENDLY GREEN MATERIAL |
Maximum pcb size |
550*700 mm (up to 1000 mm in single sided cards) |
Material thickness |
Minimum 0.15 mm - …. - maksimum 5.00 mm |
Copper thickness |
18 um – 35 um -70 um -105 um |
Minimum line thickness |
0.10 mm |
Minimum line gap |
0.10 mm |
| Minimum hole diameter / Hole tolerance |
0.20 mm / +,- 0.05 mm |
Solder mask colors |
Green, Yellow, Blue, Red, Black, White |
Surface coating types |
OSP,HAL,Unleaded HAL (ROSH) ,Gold (soft,hard,immersion), Silver ,Carbon press, Peelable mask |
Frame cut |
CNC,V-cut,Pres |
|
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